5 ESSENTIAL ELEMENTS FOR MONOCRYSTALLINE SILICON

Wire-saw wafer slicing is probably the vital production systems for industrial crystalline silicon PV cells, and improvements in wafer slicing engineering have resulted in a reduction in raw wafer thickness from 370 μm to 180 μm since 1997 for Sharp industrial polycrystalline-silicon cells (Determine six). To introduce wafers thinner than 150 μm